| ‘g V BYv26DGP, BYv26EGP7 www'V'Shay'C°m Vishay General Semiconductor ELEcTRIcAL cHARAcTERIsTIcs (TA = 25 0C unless otherwise noted) PARAMETER Bwzeeep Minimum avalanchebreakdown voltage Maximum instantaneousforward voltage Maximum DC reverse current at rated DC blocking voltage TA : 165 “C IF: 0.5A,IR:1.0A, I": 0.25 ABYV26EGPHE3/54 (I) 13“ diameter paper tape and reel Typical junction capacitance 4.0 V, 1 MHZ THERMAL cHARAcTERIsTIcs (TA = 25 00 unless otherwise noted) PARAMETER BYV26EGP Typical thermal resistance N ates (‘J Thermal resistance from junction to ambient at 0.375" (9.5 mm) lead length, mounted on PCB with 0.5“ x 0.5“ (12 mm x 12 mm) copper pads (2) Thermal resistance from junction to lead at 0.375" (9.5 mm) lead length with both leads attached to neatsink 1 1 llmmlllllllmlllllllmmll llmmlllllllmlllllllmmll Max. reverse recovew timeNote BYv26EGPHE3/73 (I) Ammo pack packaging ii) AEC-Q101 quali?edRATINGS AND cHARAcTERIsTIcs cunvEs (TA = 25 Cc unless otherwise noted) 1 2 1.5 2 ReS.s(We 0, TL : Lead Temperature : inductive Load l l 1.6 A 1 D L... Mom... I h on Heatslnks A 1.46 H K % E D E ‘I 3 ‘-2 E A6 5 1.0 E U 5 V 5 A MountedonPCB ‘ I A as 5 U4 ::irti::a::e.n;::i ? § 06 a copper Fads <7 0 4M u 2u U E: 0 2 > <( 0 25 50 75 100 I25 I50 175 0.6 0 El Temperature ("C) Average Forward Current (A) Fig. 1 - Maximum Forward Current Derating Curve Fig. 2 - Forward Power Loss Characteristics Revision: 11-Dec-13 2 Document Number: 88554 For technical questions within your region: DiodesAmericas@vishaytcom, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.eom/doe?91000 |